Affinity bond layer

摘要

A method and apparatus for bonding a first substrate to a second substrate can include an intermediate layer disposed between the substrates. In one embodiment, the intermediate layer can be disposed to a bonding area of the first substrate and only one adhesive layer can be disposed between the intermediate layer and the second substrate. In other embodiments, a plurality of intermediate layers can be used.

主权项

1. A method of bonding a first substrate with a second substrate, the method comprising:
bonding an affinity layer to the first substrate such that the affinity layer has a first exposed surface, wherein the affinity layer includes particles within a carrier material; applying an adhesive layer to the second substrate such that the adhesive layer includes a second exposed surface, wherein the affinity layer is configured to form a stronger bond with the first substrate than the adhesive layer with the first substrate, wherein the adhesive layer is configured to form a stronger bond with the second substrate than the affinity layer with the second substrate; and coupling the first exposed surface with the second exposed surface such that the first substrate is bonded to the second substrate.