发明名称 LIGHT EMITTING ELEMENT MODULE SUBSTRATE, LIGHT EMITTING ELEMENT MODULE, AND ILLUMINATING DEVICE
摘要 According to an aspect of the invention, there is provided a light emitting element module substrate including: a laminated plate; and a metal layer. The laminated plate includes a base metal plate and an insulating layer provided on the base metal plate. The metal layer is provided on the insulating layer. The metal layer includes a mounting section on which a light emitting element is to be mounted, and a bonding section to which a wiring electrically connected to the light emitting element is to be bonded. The metal layer includes a silver layer which is an uppermost layer of at least one of the mounting section and the bonding section and is formed by electrolytic plating. The mounting section and the bonding section are electrically isolated from a periphery of the laminated plate.
申请公布号 US2014322841(A1) 申请公布日期 2014.10.30
申请号 US201414329212 申请日期 2014.07.11
申请人 Kabushiki Kaisha Toshiba ;Toshiba Lighting & Technology Corporation 发明人 HAPPOYA Akihiko;Izumi Masahiro;Sanpei Tomohiro
分类号 H01L33/40;H01L33/62 主分类号 H01L33/40
代理机构 代理人
主权项 1. (canceled)
地址 Minato-ku JP