SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which is thin and has high reliability without deteriorating adhesion when connecting a semiconductor element and a base material, or connecting semiconductor elements with each other.SOLUTION: A semiconductor device manufacturing method comprises: a die bonding process of sequentially adhering each semiconductor element 1SA to a base material on a heated stage or to a predetermined position of a semiconductor element 10 in a lower stage; a process of connecting a terminal formed in an opening of the semiconductor element 10 and a terminal 13 formed on the base material by a bonding wire; and a process of encapsulating the semiconductor element 10 and the bonding wire. The die bonding process is a process of adhering each semiconductor element to the base material or to the predetermined position of the semiconductor element in the lower stage by using a semi-cured adhesive, a semi-cured film or a liquid adhesive (B-stage adhesive) 12.