<p>A substrate encapsulation method. The method comprises: forming a metal layer (5) at a location of the inner surface of a first substrate (1) to be coated with a glass powder solution (2); coating the glass powder solution (2) on the metal layer (5); heating the first substrate (1) so as to remove a solvent in the glass powder solution (2); aligning the first substrate (1) and a second substrate (2) and making the inner surfaces of the two substrates opposite to each other; melting the metal layer (5) and making the glass powder melt at the same time; and aligning and encapsulating the first substrate (1) and the second substrate (2) by using the melted metal layer (5) and the glass powder.</p>
