| 摘要 |
PROBLEM TO BE SOLVED: To provide solder and a die bond structure which can improve thermal shock resistance.SOLUTION: In an on-vehicle semiconductor device 1, a bare element 20 is die-bonded by high-temperature lead-free solder 30 on a metal circuit board 10 as a joined member. The solder 30 contains Zn as a major component, and contains 6-8 mass% of indium. The solder may contain bismuth (Bi), phosphorus (P), and germanium (Ge). Furthermore, the solder can contain aluminum, and may contain 5 mass% of the aluminum, and 0.1 mass% of the germanium. |
