| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor power module which levels a current flowed from a semiconductor power device and effectively radiates heat generated in the semiconductor power device, and to provide a method for manufacturing the semiconductor power module.SOLUTION: In a power module 1, a power device 18 is joined to a base part 8 of a case 2, and a metal block 24 is joined to a surface 181 of the power device 18. A source terminal 4 for supplying electric power to the power device 18 is joined to the metal block 24. This structure levels a current flowed from the power device 18 and radiates heat generated in the power device 18 effectively.</p> |
