| 摘要 |
A bonding agent (12) for bonding two bodies (14, 16), e.g. an electronic component to another electronic component or to an electronic support is disclosed in various embodiments. The bonding agent (12) has a bonding material (16) and a heating material. The bonding material (16) can have an adhesive, for example a chemically curable adhesive (polyaddition adhesive, for example epoxy resin), or a melting bonding agent, for example solder, a fusion adhesive, (hot-melt adhesive, hot glue). The bonding material can be on the basis of a transparent polymer, such as an epoxy-based, silicone-based or hybrid-based material which allows the bonding agent to be used for optoelectronic components. The heating material has a ferromagnetic material, e.g. ferromagnetic heating particles (30) and is embedded in the bonding material (16) in order to warm the latter (16). During the bonding process, the heating material is inductively warmed or heated with the aid of an alternating magnetic field, whereby the bonding material (16) is also warmed or heated such that it cures or liquefies. |
