| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for mounting a semiconductor element which achieves excellent heat radiation characteristics without adding a heat spreader and new members, changing a mold, and adding after processing, and to provide a semiconductor device which uses the wiring board. <P>SOLUTION: A semiconductor device has at least one semiconductor element mounted on a wiring board. In the wiring board for mounting the semiconductor element, a wiring pattern 2 on a semiconductor element mounting surface is provided at an area ranging from a semiconductor element projection surface to a wiring board end part, except a portion 8 required for electrically connecting an inner layer of the wiring board with the semiconductor element and a portion 14 required for substrate processing, to be used as a heat conduction path. In the semiconductor device, the semiconductor element is mounted on the wiring board for mounting the semiconductor element. <P>COPYRIGHT: (C)2013,JPO&INPIT |
