| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding method of an electronic circuit board by which terminals can be electrically connected each other with high reliability by surely positioning between the boards. <P>SOLUTION: In the bonding method of the electronic circuit board to electrically connect first and second connecting terminals by connecting the boards 10 and 20 after positioning the board 10 having a first connecting terminal and the board 20 having a second connecting terminal by opposing the first and second connecting terminals, while a positioning terminal 112 is provided at a predetermined position on the surface in the same direction with the surface where the first connecting terminal is provided, a positioning terminal 212 is provided at a predetermined position on the surface in the same direction with the surface where the second connecting terminal is provided. After positioning the boards 10 and 20 to oppose the first and second connecting terminals, the positioning of the boards 10 and the board 20 is performed by confirming the conduction between the positioning terminals 112 and 212. <P>COPYRIGHT: (C)2013,JPO&INPIT |
