MOUNTING APPARATUS, COATING APPARATUS, MOUNTING METHOD, COATING METHOD, AND PROGRAM

摘要

A mounting apparatus including: a holding portion capable of holding and releasing an electronic component including a plurality of electrodes; a movement mechanism configured to move the holding portion; a coating portion in which a coating object to be applied onto the plurality of electrodes is set; and a controller configured to control the holding portion to hold the electronic component, control the movement mechanism to move the holding portion to a position above the coating portion, control the holding portion to release the electronic component above the coating portion so that the coating object is applied onto the electrodes, control the holding portion to hold the released electronic component again, control the movement mechanism to move the holding portion to a position above one of a substrate and another electronic component, and control the electronic component to be mounted on one of the substrate and the another electronic component.