SEMICONDUCTOR STACK PACKAGE APPARATUS

摘要

PURPOSE: A semiconductor stack package apparatus is provided to reduce the electrical cross talk between redistribution layer by forming a metal core layer in an upper and a lower substrate. CONSTITUTION: A chip pad is formed in the active surface of an upper semiconductor chip(110). A substrate pad is formed in the upper surface of the upper substrate(120). A middle solder ball is adhered to the lower surface of the upper substrate. A wire(130) electrically connects the chip pad to the substrate pad. An encapsulating material(140) surrounds the active surface and the wire and protects.