| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve both removability of unnecessary soldering material and favorable characteristics of a ceramic substrate itself. <P>SOLUTION: A method of manufacturing a circuit substrate includes: a joining step of joining a metal circuit plate (metal plate) with a ceramic substrate after forming a soldering material on the surface of the ceramic substrate; a metal plate etching step of selectively etching the metal circuit plate after forming a mask on the surface of the metal circuit plate; and a soldering material removing step of etching the soldering material at a part where the metal circuit plate is removed by etching. When Rsk is made to be -0.1 to +0.25, while maintaining favorable characteristics in the ceramic substrate, removability of unnecessary soldering material on the ceramic substrate is found to be favorable as well. <P>COPYRIGHT: (C)2013,JPO&INPIT |
