发明名称 SUBSTRATE CONNECTION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate connection method capable of simply checking a distance between substrates. <P>SOLUTION: A substrate connection method includes: a step of preparing a first structure including a first substrate having a first surface, an electrode positioned on the first surface, a first resin projection positioned on the first surface, a wiring which is connected to the electrode and covers a first part of the first resin projection, and a second resin projection which is positioned in an inspection region of the first surface and whose height from the first surface is lower than the first resin projection, and a second structure including a second substrate which is composed of a light transmissive material and has a second surface and an electrical connection part positioned on the second surface; a step of positioning the first structure and the second structure so that the first surface faces the second surface and connecting the wiring on the first resin projection and the electrical connection part; and an inspection step of checking the distance between the first substrate and the second substrate by checking whether the second resin projection is in contact with the second surface. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012199308(A) 申请公布日期 2012.10.18
申请号 JP20110061247 申请日期 2011.03.18
申请人 SEIKO EPSON CORP 发明人 NEISHI YUZO
分类号 H01L21/60 主分类号 H01L21/60
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