WAFER LEVEL PACKAGED DEVICE FORMED HERMETIC SEAL INSPECTION PART AND MANUFACTURING METHOD THEREFOR

摘要

PURPOSE: A wafer level packaged device with a hermetic seal inspection part and a manufacturing method thereof are provided to improve device reliability and performance by revising device characteristics according to changes in the degree of a vacuum while monitoring a sealing state inside a package in real time. CONSTITUTION: A main apparatus part(20) is formed on a silicon substrate(10). A hermetic seal inspection part(30) is formed at a predetermined portion on the silicon substrate. The hermetic seal inspection part performs a hermetic seal test. The hermetic seal inspection part forms a sensing film by arranging a heater electrode(14) on an upper portion of a sensing electrode(16). The hermetic seal inspection part monitors the degree of a vacuum in a package device in real time.