| 摘要 |
A substrate structure including a first metal substrate, a second metal substrate, a frame fixture, a first conductive layer, a second conductive layer, a first adhesive layer and a second adhesive layer is provided. The second metal substrate is stacked over the first metal substrate. The frame fixture is disposed around the first metal substrate and the second metal substrate. The first adhesive layer is disposed between the first conductive layer and the first metal substrate, and between the first conductive layer and the frame fixture. The first conductive layer is fixed on an upper surface of the frame fixture by the first adhesive layer. The second adhesive layer is disposed between the second conductive layer and the second metal substrate, and between the second conductive layer and the frame fixture. The second conductive layer is fixed on a lower surface of the frame fixture by the second adhesive layer.
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