| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance quality control of a semiconductor device. <P>SOLUTION: Since a thin-out pattern 5i of dimples 5h is stamped on a top surface 5e of a die pad 5d in a QFN 1, the stamp can be confirmed by an X-ray inspection, or the like, even after individualization, and a cavity of a resin molding die can be specified. Consequently, defective QFNs 1 in an visual inspection can be selected when malfunction occurs, and quality control can be enhanced in assembling work of the QFN 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
