SOLDER INK AND ELECTRONIC DEVICE PACKAGE USING SAME
摘要
The present invention relates to solder ink and an electronic device package using same, wherein the solder ink comprises: a solder powder including an alloy having tin (Sn); a binder including a first resin composed of rosin resin or rosin modified resin; an activator; and a solvent.
申请公布号
WO2011102569(A1)
申请公布日期
2011.08.25
申请号
WO2010KR01491
申请日期
2010.03.10
申请人
DUK SAN TEKOPIA CO. LTD;JANG, YONG UN;KIM, SUNG CHUL;CHU, YONG CHEOL;JANG, SEUNG JUN;SON, YOON SANG
