摘要 |
PROBLEM TO BE SOLVED: To provide a group III-V semiconductor single crystal having a large size and a low dislocation density. SOLUTION: An n-type gallium arsenide substrate has an average dislocation density of less than 30 cm<SP>-2</SP>and a silicon concentration of 5×10<SP>16</SP>cm<SP>-3</SP>or more and less than 5×10<SP>17</SP>cm<SP>-3</SP>. A semi-insulating gallium arsenide substrate has an average dislocation density of less than 300 cm<SP>-2</SP>, a silicon concentration of less than 5×10<SP>15</SP>cm<SP>-3</SP>, and a specific resistance of 1×10<SP>3</SP>Ωcm or more. An n-type indium phosphide substrate has an average dislocation density of less than 50 cm<SP>-2</SP>, a sulfur concentration of 1×10<SP>17</SP>cm<SP>-3</SP>or more and less than 3×10<SP>18</SP>cm<SP>-3</SP>. Alternatively, an n-type indium phosphide substrate has an average dislocation density of less than 300 cm<SP>-2</SP>and a tin concentration of 1×10<SP>17</SP>cm<SP>-3</SP>or more and less than 5×10<SP>18</SP>cm<SP>-3</SP>. A semi-insulating indium phosphide substrate has a dislocation density of less than 300 cm<SP>-2</SP>and a specific resistance of 1×10<SP>3</SP>Ωcm or more. COPYRIGHT: (C)2011,JPO&INPIT |