| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a high reliability electronic device by suppressing deformations of a wiring board. <P>SOLUTION: A stiffener 12, arranged on a package substrate 11, is provided with a protrusion 12b protruding to a side opposite to the side of the package substrate 11 so as to surround opening 12a of the stiffener. A semiconductor chip 13 is arranged on the package substrate 11 arranged with such a stiffener 12. The stiffener 12, provided with the protrusion 12b, is used in an electronic device, thereby suppressing deformation of the package substrate 11. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
