Inter-chip communication interface for a multi-chip package

摘要

A package comprising a first and a second die is provided. An interface connects the first die and said second die. At least one of said first and second dies comprises a plurality of signal sources, each of said signal sources having at least one quality of service parameter associated therewith, a plurality of queues , said queues having different priorities; and means for allocating a signal from a respective one of said signal sources to one of said plurality of queues in dependence on the at least one quality of service parameter associated with the respective signal source. The interface is configured such that signals from said queues are transported from one of said first and second dies to the other of said first and second dies.