发明名称 ENERGY CONVERSION MECHANISM, BOILING COOLER, AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide: an energy conversion mechanism which can reduce power necessary for dissipating heat generated from an LSI and electronic device, and also can suitably cool the LSI and electronic device; a boiling cooler; and an electronic device. SOLUTION: The energy conversion mechanism includes: a case 51-1 for housing a liquid 41-1, which is boiled by heating, inside; a heat transmission member 31-1, which is joined to the case 51-1 so as to be in contact with the liquid, and has thermal conductivity; a vibrator 61-1 joined to the case 51-1 so as to be in contact with the liquid 41-1 and arranged so as to collide with boiling bubbles 41-1b generated when the liquid 41-1 is boiled by heat transmitted from the heat transmission member 31-1. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011044541(A) 申请公布日期 2011.03.03
申请号 JP20090190961 申请日期 2009.08.20
申请人 NEC CORP 发明人 ONISHI YASUHARU;YOSHIKAWA MINORU;SAKAMOTO HITOSHI;MATSUNAGA ARIHITO;HASHIGUCHI TAKEYA
分类号 H05K7/20;H01L23/427 主分类号 H05K7/20
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