| 摘要 |
PURPOSE: A camera module is provided to implement miniaturization and improve the reliability in the operation by mounting an image sensor and an image signal processor inside the housing thereof. CONSTITUTION: An image signal processor(30) is mounted at a substrate(50) electrically connected to an image sensor(20) and has a lamination structure. A housing(40) is assembled at a lens barrel and bonded with the substrate, and accepts the image sensor and the image signal processor therein. A supporting unit protrudes the substrate, and spaces the image sensor from the image signal processor to form a thermal discharge flow path. |
