| 摘要 |
An ingot of a copper-base alloy containing a total of 0.01-30 wt % of at least one element selected from among Sn, Ni, P, Zn, Si, Fe, Co, Mg, Ti, Cr, Zr and Al, with the balance being Cu and incidental impurities, is homogenized by annealing, subjected to repeated cycles of cold rolling and annealing, then cold rolled at a reduction ratio Z which satisfies the following relation:<paragraph lvl="0"><in-line-formula>Z>=100-10X-Y (1)</in-line-formula>[where Z is the percent reduction by cold rolling; X is the content in wt % of Sn; Y is the total content in wt % of any elements other than Sn], and thereafter subjected to cold annealing at a temperature below the recrystallization temperature to produce a copper-base alloy having a surface X-ray diffraction intensity ratio SND of at least 10 [SND=I{220}/I{200}; I{220} is the X-ray diffraction intensity of {220} and I{200} is the X-ray diffraction intensity of {200}] while exhibiting improved punching properties on press due to the balance between electrical conductivity, strength, spring property, hardness and bending properties.
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