IMPROVEMENT OF SOLDER INTERCONNECT BY ADDITION OF COPPER

摘要

PURPOSE: An improvement of a solder interconnect by adding copper, which forms an IMC section between a solder bump and a bump pad, is provided to reduce bump malfunction and to improve the mechanical property of a joint between the bump and pad. CONSTITUTION: An improvement of a solder interconnect by adding copper comprises next steps. An electronic device(100) and a substrate(120) are offered. A copper - layer of inclusion is formed on a nickel - layer of inclusion before a reflow process is applied to an electronic device. A solder bump pad(130) is installed on the substrate.