Co-continuously Phase-Separated Adhesive Composition for Die Bonding in Semiconductor Assembly and Adhesive Film Prepared Therefrom
摘要
<p>An adhesive film for semiconductor assembly includes a binder portion 1, a sub-binder portion, and a cured portion, wherein the binder portion 1 and the sub-binder portion co-exist in a co-continuous phase structure after curing begins.</p>
