METHOD FOR MANUFACTURING THE THIN FILM THERMOELECTRIC MODULE AND MULTI-CHIP PACHAGE USING THE SAME

摘要

PURPOSE: A method for manufacturing a thin film type thermoelectric module and a laminated semiconductor chip package using the same are provided to prevent a semiconductor chip from being damaged by discharging heat from each semiconductor chip. CONSTITUTION: A photosensitive resin layer is formed on by coating a photoresist on the upper side(11) of a silicon substrate(10). A mask is formed on the photosensitive resin layer. An insulation layer(21) is formed on the substrate. A diffusion preventing layer(22) is formed on the photosensitive layer and the insulation layer. A seed layer(23) is formed on the diffusion preventing layer.