发明名称 |
SEMICONDUCTOR POWER MODULE, INVERTER, AND METHOD OF MANUFACTURING A POWER MODULE |
摘要 |
A semiconductor power module includes an insulated substrate mounting with a plurality of power semiconductor devices and a heat sink for radiating a heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the heat sink and the insulated substrate are bonded in metallic bonding with another surface opposite of one surface on which the radiation fins are formed with the base of the heat sink.
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申请公布号 |
US2010208427(A1) |
申请公布日期 |
2010.08.19 |
申请号 |
US20100707207 |
申请日期 |
2010.02.17 |
申请人 |
HITACHI, LTD. |
发明人 |
HORIUCHI KEISUKE;NISHIHARA ATSUO;HOZOJI HIROSHI;HIYOSHI MICHIAKI;YOKOZUKA TAKEHIDE |
分类号 |
H05K7/20;H01L21/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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