WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A wafer level package and a manufacturing method thereof are provided to improve the electrical connection reliability by uniformly forming the upper side of a main post and a core post in contact with a substrate. CONSTITUTION: A redistribution pattern including a post pad which is electrically connected to a chip pad is formed(S110). A passivation layer is formed on a semiconductor chip(S120). A sacrificial layer is formed on the passivation layer(S130). A core post is formed by stacking conductive materials on the post pad(S140). A main post is formed by charging the conductive material on a second window(S150). The sacrificial layer is removed(S160).