<p>PURPOSE: A multi-layer printed circuit board and a manufacturing method thereof are provided to prevent the warpage of a PCB by differently forming the thickness of both sides of the outermost layer insulating layer. CONSTITUTION: A buildup layer(140) is formed by laminating a layer(141) in an outermost insulating layer. A first solder resist layer(150) which is laminated in different surface of the build-up layer is formed. An outermost insulating layer(120) which is laminated in one side of the build-up layer is formed. An outer connection pad(130) which is exposed to the surface by passing through the outermost insulating layer is formed. An opening exposing the outer connection pad is formed. A second solder resist layer(155) which is laminated on the outermost insulating layer is formed.</p>
