| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board and a method of mounting an electronic component, wherein damage to the circuit board during mounting can be reduced. <P>SOLUTION: The method of mounting the electronic component includes the processes of: forming preliminary solder 1 having a projecting top surface on the electrode pad 3 of the circuit board 1; forming a resin pedestal 31a having a flat or recessed top surface on the preliminary solder 11; mounting a semiconductor element 20 with a solder bump 22 formed on the resin pedestal 31a with the solder bump 22 facing downward; and joining the preliminary solder 11 and solder bump 22 together by the preliminary solder 11, resin pedestal 31a, and solder bump 22 reflow. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
