发明名称 Optimized Device Isolation
摘要 A structure for a semiconductor device includes an isolated MOSFET (e.g., NFET) having triple-well technology adjacent to an isolated PFET which itself is adjacent to an isolated NFET. The structure includes a substrate in which is formed a deep n-band region underneath any n-wells, p-wells and p-band regions within the substrate. One p-band region is formed above the deep n-band region and underneath the isolated p-well for the isolated MOSFET, while another p-band region is formed above the deep n-band region and underneath all of the p-wells and n-wells, including those that are part of the isolated PFET and NFET devices within the substrate. The n-wells for the isolated MOSFET are connected to the deep n-band region. The resulting structure provides for improved device isolation and reduction of noise propagating from the substrate to the FETs while maintaining the standard CMOS spacing layout spacing rules and electrical biasing characteristics both external and internal to the triple-well isolation regions.
申请公布号 US2010117122(A1) 申请公布日期 2010.05.13
申请号 US20080269073 申请日期 2008.11.12
申请人 BENOIT JOHN J;COLLINS DAVID S;FEILCHENFELD NATALIE B;GAUTSCH MICHAEL L;LIU XUEFENG;RASSEL ROBERT M;ST ONGE STEPHEN A;SLINKMAN JAMES A 发明人 BENOIT JOHN J.;COLLINS DAVID S.;FEILCHENFELD NATALIE B.;GAUTSCH MICHAEL L.;LIU XUEFENG;RASSEL ROBERT M.;ST ONGE STEPHEN A.;SLINKMAN JAMES A.
分类号 H01L27/092;H01L27/085 主分类号 H01L27/092
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