| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a joined substrate in which an amount of squeeze out of an adhesive is uniform, spots left without spread with the adhesive are reduced, deflection after bonding setting is suppressed, and generation of cracks in substrates is lessened. Ž<P>SOLUTION: When a bonding jig 10 is pressed at one point, a concave 11 of the bonding jig 10 and non bonding surfaces 22 and 42 of the substrates 2 and 4 contact to each other first at one point. The bonding jig 10 is deformed while the concave 11 of the bonding jig 10 sticks following the non bonding surfaces 22 and 42 of the substrates 2 and 4 from the contact spot with nearly the same force being applied. Therefore, a load is dispersed and prevented from being concentrated to one point to the substrates 2, 3 and 4. Hence the manufacturing method for the joined substrate 1 can be obtained wherein adhesives before setting 51 and 61 are uniformly spread, the amount of squeeze out of the adhesives 5 and 6 is uniform, and spots left without spread with the adhesives 5 and 6 are reduced. Deflection of the joined substrate 1 after bonding setting is suppressed. Moreover, generation of cracks to the substrates is lessened. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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