BRUSH ASSEMBLY FOR SEMICONDUCTOR PACKAGE MANUFACTURING MACHINE

摘要

PURPOSE: A brush assembly for semiconductor package manufacturing machine is provided to reduce water absorption latency time of a brush by making the water supplied to the whole of the brush through a water supply hole. CONSTITUTION: A brush assembly for semiconductor package manufacturing machine is composed of a brush(10), a bracket(20), and a water supply unit. A plurality of protrusions is protruded from the external side of a brush which is contact with a semiconductor package and is flexible to moving direction so that a foreign material is removed. A bracket supports the brush and water supply unit supplies the brush.