| 摘要 |
A lower clad layer 26 formed with a concave groove 25 and a flat upper clad layer 30 are prepared. Polymer adhesive 27 having a refraction index greater than the lower clad layer 26 is applied on the lower clad layer 26. The polymer adhesive 27 is a mixture of a precursor consisting of monomer and oligomer of a polymer having the flexural modulus after curing of 1,000 MPa and containing hydrogen bonding group in a functional group, and the polymerization initiator. The hydrogen bonding group includes carbonyl group, amino group, imino group, and hydroxy group. The polymer adhesive 27 is then pressed down and spread by the upper clad layer 30, and the polymer adhesive 27 is cured to mold the core 28 and join the lower clad layer 26 and the upper clad layer 30 with the polymer adhesive 27, thereby manufacturing a film waveguide in which separation is less likely to occur at the interface between the clad layers. |
