发明名称 |
Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition |
摘要 |
An insulating film having a concave portion is formed on a semiconductor substrate. The inner surface of the concave portion and the upper surface of the insulating film are covered with an auxiliary film made of Cu alloy containing a first metal element other than Cu. A conductive member containing Cu as a main composition is deposited on the auxiliary film, the conductive member being embedded in the concave portion. Heat treatment is performed in an atmosphere containing P compound, Si compound or B compound. With this method, a content of element other than Cu in the conductive member can be reduced and a resistivity can be lowered.
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申请公布号 |
US7507666(B2) |
申请公布日期 |
2009.03.24 |
申请号 |
US20050294471 |
申请日期 |
2005.12.06 |
申请人 |
FUJITSU MICROELECTRONICS LIMITED |
发明人 |
NAKAO YOSHIYUKI;KITADA HIDEKI;OHTSUKA NOBUYUKI;SHIMIZU NORIYOSHI |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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