SHEET FOR WAFER PROCESSING

摘要

PROBLEM TO BE SOLVED: To prevent a mounter, an adhesive tape for peeling or the like from sticking to a sheet for wafer processing in a semiconductor manufacturing process. SOLUTION: The invention relates to the sheet for wafer processing which comprises dicing sheets in which adhesive layers are laminated on a base material and ring-like both-side adhesive sheets. This sheet for wafer processing is characterized by having an adhesion part in a center section on a field of the base material and by having non-adhesion parts around the adhesion part. It is desirable that the ring-like both-side adhesive sheets are laminated in outer edge parts on the same field of the base material having the adhesion part. COPYRIGHT: (C)2009,JPO&INPIT