| 摘要 |
PROBLEM TO BE SOLVED: To clean a probe above a semiconductor device without moving the problem from a position above the semiconductor device to a cleaning sheet, and avoid an alignment error and a contact failure between an electrode pad and the probe in a measurement environment of a high or low temperature other than room temperature. SOLUTION: A semiconductor device includes electrode pads as input and output terminals for an electric signal. The electrode pads include a first electrode pad made of a first pad material and a second electrode pad made of a second pad material. The first and second electrode pads formed on a wafer have at least one adjacent sides as viewed from a plane. The second pad material has a hardness equivalent to or higher than the first pad material, and also has a hardness equivalent to or lower than the hardness of the probe contacted with the electrode pad upon inspection of the semiconductor device. COPYRIGHT: (C)2008,JPO&INPIT
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