RESIN-COATED INORGANIC POWDER COMPOSITION FOR SEALING ELECTRONIC ELEMENT AND TABLET FOR SEALING ELECTRONIC ELEMENT OBTAINED USING THE SAME, AND ELECTRONIC ELEMENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin-coated inorganic powder composition for sealing electronic elements that exhibits excellent adhesion to electronic elements and can realize a thin structure, a tablet obtained using the same, and an electronic element device using these. SOLUTION: The resin-coated inorganic powder composition for sealing electronic elements comprises an aggregate composed of an inorganic powder coated with a resin layer comprising the following components (A) and (B), where the content ratio of the inorganic powder is set to 80-95 wt.% based on the whole composition. (A) An aminomethylol group-containing polycondensate obtained by causing a compound bearing at least two amino groups in one molecule to react with formaldehyde in a molar ratio of 1.5-2.5. (B) A thermosetting resin. COPYRIGHT: (C)2008,JPO&INPIT