| 摘要 |
PROBLEM TO BE SOLVED: To provide a slit coat type coater which is capable of preventing the generation of coating non-uniformity by correcting the warping of a silicon wafer and to provide a slit coat type application method. SOLUTION: The slit coat type coater has a retaining table 20 equipped with a suction means 30 to suck and retain a retaining face 1b at the opposite side to the coated face 1a of the silicon wafer 1, a coating head 40 equipped with a slit nozzle opening 41 opposite to the coated face 1a of the silicon wafer, a measuring means 60 to measure the amount of warping of the silicon wafer 1 over the peripheral direction of the silicon wafer 1 and a plurality of press pins 73 to press the fringe part of the silicon wafer 1 by the leading front, and is provided with a press means 70 equipped with the silicon wafer 1 so that each of the press pins 73 can press the silicon wafer 1 in different timing. The slit coat type coater presses the fringe part of the silicon wafer 1 with the press pins 73 in different timing in the peripheral direction and planarizes the silicon wafer 1 by adsorbing it on the retaining table 20 with the suction means 30. COPYRIGHT: (C)2006,JPO&NCIPI |
