| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can make an external by-pass capacitor unnecessary with a simple constitution. <P>SOLUTION: The semiconductor device has divided die pads 2a and 2b. The by-pass capacitor is constituted of the die pad 2a; a dielectric material 4; and the die pad 2b by spreading the dielectric material 4 between the divided die pads 2a and 2b, and installing a semiconductor chip 1 on the die pads 2a and 2b through an insulating bonding material 3, and, in addition, connecting a power source terminal 6a on the semiconductor chip 1 to the die pad 2a through a wire 5a and a ground terminal 6b on the chip 1 to the die pad 2b through another wire 5b. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
