| 摘要 |
PROBLEM TO BE SOLVED: To provide a low temperature baked ceramic multilayer substrate which adopts a ball grid array structure, does not cause the problem of occurrence of a crack by thermal stress even if the substrate is mounted on a circuit board consisting of a resin substrate whose thermal expansion coefficient largely differs, and improves reliability. SOLUTION: The low temperature baked ceramic multilayer substrate is provided with surface electrodes 12 arranged on a lower face of the low temperature baked ceramic multilayer substrate 11, a low temperature baked ceramic single layer substrate part 13 which is provided with openings 13a in a part of the surface layer electrode 12 and is arranged on the lower face of the multilayer substrate part 11, solder paste 14 with which the openings 13a of the single layer substrate part 13 is filled and solder balls 15 fused to the surface electrodes through solder paste 14. COPYRIGHT: (C)2009,JPO&INPIT
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