发明名称 |
Method for producing a portable card for information processing |
摘要 |
This card (4) exhibits a semiconductor chip (5) arranged in the card (4) and external connecting areas (3) which are connected to the contacting surfaces (17) of the semiconductor chip (5) by means of a conductor network (6). The semiconductor chip (5) and the external connecting areas (3) are fitted into a window-like recess of a card body (2) as a unit (1), the thickness of which approximately corresponds to the thickness of the card body (2) and on one surface of which the external connecting areas (3) are arranged. The unit (1) is provided on at least one of its surfaces with an electrically conductive layer (15) which is electrically conductively connected to the external connecting area (3) forming the earth contact. <IMAGE> |
申请公布号 |
DE3130213(A1) |
申请公布日期 |
1983.02.17 |
申请号 |
DE19813130213 |
申请日期 |
1981.07.30 |
申请人 |
SIEMENS AG |
发明人 |
SCHMITTER,DETLEV,ING.;ROHDE,VOLKER,ING. |
分类号 |
G06K19/077;H01L23/498 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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