| 摘要 |
A semiconductor memory device, a device for packaging a multi-chip, and an operation method thereof are provided to enhance memory efficiency by improving an operation rate of a multi-chip package comprising MLCs(Multi Level Cell) capable of storing a plurality of bits. A multi-chip package(120) includes a plurality of memory devices(124) having MLCs(123), and a part of the memory devices is set and operated as a buffer(122) according to the control signal. Each memory device includes the buffer set by a controller(121) and temporarily storing data for programs, and an MLC array comprising MLCs capable of storing a plurality of bits of the data stored in the buffer according to the control signal of the controller. The buffer is operated as a single level cell or the MLC storing 2-bit data. The controller temporarily stores the inputted data to the buffer and stores the data stored in the buffer to the MLC array. The controller includes a controller buffer(125) capable of temporarily storing the data exceeding capacity of the buffer.
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