发明名称 |
PACKAGED INTEGRATED CIRCUIT WITH ENHANCED THERMAL DISSIPATION |
摘要 |
A semiconductor package (10) uses a plurality of thermal conductors (56-64) that extend upward within an encapsulant (16) from one or more thermal bond pads (22, 24, 26) on a die (14) to disperse heat. The thermal conductors may be bond wires or conductive stud bumps and do not extend beyond a lateral edge of the die. One or more of the thermal conductors may be looped within the encapsulant and exposed at an upper surface of the encapsulant. In one form a heat spreader (68) is placed overlying the encapsulant for further heat removal. In another form the heat spreader functions as a power or ground terminal directly to points interior to the die via the thermal conductors. Active bond pads may be placed exclusively along the die's periphery or also included within the interior of the die. |
申请公布号 |
KR20080044235(A) |
申请公布日期 |
2008.05.20 |
申请号 |
KR20087002187 |
申请日期 |
2008.01.28 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
HESS KEVIN J.;LEE CHU CHUNG |
分类号 |
H01L23/34;H01L23/48 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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