| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device whereby a highly reliable electronic device can be manufactured efficiently, the highly reliable electronic device, an inspecting method of the electronic device, and a method whereby the highly reliable electronic device is manufactured efficiently. SOLUTION: The manufacturing method of the electronic device includes a process of preparing a semiconductor device 1 having a semiconductor chip 10 whereon electrodes 12 are formed, and having resin protrusions 20 at least having a convex curved surface as its upper end surface, and further, having conductive layers (wirings 30) each of which covers at least a portion of the upper end surface of each resin protrusion, a process of preparing a wiring substrate 50 having a light transmitting substrate 52, and having wiring patterns 54 formed on the light transmitting substrate, and a process of so mounting the semiconductor device 1 on the wiring substrate 50 as to crush the resin protrusions 20 by the semiconductor chip 10 and the wiring substrate 50. In the process of mounting the semiconductor device on the wiring substrate, the interval between the wiring substrate 50 and the semiconductor chip 10 is controlled, based on the light reflected by the semiconductor device 1 and transmitted through the wiring substrate. COPYRIGHT: (C)2008,JPO&INPIT
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