Method for fabricating an image sensor having curved micro-mirrors over the sensing photodiode

摘要

The invention involves the integration of curved micro-mirrors (950) over a photo-diode active area (collection area) in a CMOS image sensor (CIS) process. The curved micro-mirrors (950) reflect light that has passed through the collection area back into the photo diode. The curved micro-mirrors (950) are best implemented in a backside illuminated device (BSI) (900).