| 摘要 |
A thermally conducting multi-layer film which includes of a first layer configured by an electrically insulating, thermally conducting, filled in, highly elastic elastomer layer which due to its gel characteristics can be permanently molded onto the uneven surface structure of an electronic circuit, and at least one second layer which is considerably thinner than the first layer and firmly linked therewith. The second layer is configured as a PCM layer which is applied to the first layer and thins out and/or brings about a change of state under the influence of pressure and/or temperature when a cooling body or housing element is applied. |
