| 摘要 |
<p>Disclosed is a film-forming composition to be used in a coating diffusion method, which enables to diffuse an impurity of higher concentration into a silicon wafer, while forming a silica coating film at the same time. Specifically disclosed is a film-forming composition for forming a diffusion film on a silicon wafer for diffusing an impurity element into the silicon wafer. This film-forming composition contains (A) a high molecular weight silicon compound, (B) an oxide of the impurity element or a salt containing the element, and (C) a porogen.</p> |
