| 摘要 |
A semiconductor apparatus and a manufacturing method thereof are provided to improve mechanical strength of the semiconductor apparatus by using a supporter for supporting the whole surface of a semiconductor chip. A light receiving device(11) is formed on a surface of a semiconductor chip(10A). The light receiving device receives light from a rear surface of the semiconductor chip. A pad electrode is connected to the light receiving device and formed on the surface of the semiconductor chip. A supporter(15) is formed on the surface of the semiconductor chip. A via hole passes through the supporter to expose a surface of the pad electrode. A wire(17) is connected to the pad electrode. The wire is extended to a surface of the supporter through the via hole. A printed circuit board(30) and the wire extended to the surface of the supporter are facing to each other and are electrically connected. The light receiving device is an imaging device comprised of a CCD(Charge Coupled Device).
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