| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device with improved reliability and its manufacturing method. <P>SOLUTION: The electronic device 100 includes a surface-mounting connector 400 wherein a plurality of terminals 410 are arranged along the lengthwise direction of a housing 420 and which is mounted to a circuit board 300. Buffering wiring patterns 340 arranged in a plurality of layers including an arrangement area 313 of a connector 400 are included as a wiring pattern forming the circuit board 300, and a plurality of long patterns 341 having a pattern shape parallel to the lengthwise direction of the housing 420 are arranged on the same plane as a plurality of wiring layers comprised of the buffering wiring patterns 340. Furthermore, the electronic device 100 also includes a long pattern layer to be adopted to a wiring layer at least nearest to the mounting surface of the connector 400, and a short pattern layer in which a plurality of short patterns 342 having a pattern shape vertical to the lengthwise direction of the housing 420 are arranged on the same plane, and which is adopted to a wiring layer at least furthest from the mounting surface of the connector 400. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
